The Reliability of Multilayer Ceramic Capacitors: Report

accelerated acceptable acoustic addition analysis appears application average bismuth capacitance cause characteristics chip compositions constant containing cracks Cross defects delamination dependence device dielectric discussed dispersion distribution effective electrical electrode evaluation example extrinsic failed failure failure rates ferroelectric Figure firing flaws grain important improved increase insulation internal intrinsic lamination layers lead limits lower manufacturing materials measure mechanical metal methods mode mounting multilayer ceramic capacitors normal observed occur operation particles percent performance phase physical possible powder present probability problem properties range relatively reliability resistance sample scanning screening shown in Figure shows sintering SLAM solder specifications standard stress structure substrate surface T-rate Table techniques temperature termination thermal thickness typical ultrasonic units voids voltage