Modeling and Design of Compact Thermosyphons for Electronic CoolingUniversity of Michigan., 2005 |
Häufige Begriffe und Wortgruppen
acetone ADINA ambient amount of heat analogy approach assumed boiling and condensation boundary conditions bubble diameter bubble stagnation calculated compact thermosyphon condenser area control volume convective heat transfer coolant different heat dimensionless electrical electronic cooling entropy generation minimization equations evaporator section experimental fluid mass fluid temperature fluid volume following figure shows forced convection free body diagram glass syringe heat flux heat inserted heat load heat pipe heat removal heat sink heat transfer coefficient heat transfer rate heat transmitter heated surface hot spots increase interfacial forces lateral heat transfer limitation liquid bubble maximum micro scale on-chip cooling parameters performance phase change pressure drop R₁ Saeed Mohammadi saturation condition schematic Sgen single chip studied the effect surface temperature syringe Temperature and velocity temperature difference temperature reservoir thermal resistance thermosyphon in presence transistor vapor bubble velocity distribution W/cm² wall angle