An Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors

adhesion strength amps applied ARY SAN DIEGO ball media Barrel plating basket board space CALI CALIF CALIFORN CALIFORNIA UNIVERSITY capacitance meter ceramic body ceramic caps ceramic dielectric cermet pastes cermet terminals components Cross-sectional micrograph showing current density dielectric strength discussed in Section dissipation factor EDTCs electrical connections electrode spacing electroless copper electroless plating electrolytic electrolytic nickel electroplating end terminals equivalent series resistance Ethone exposed electrodes Farad glass frit Guidebook and Directory immersed insulation resistance interleaf lateral growth LIBRA LIBRARY SAN LIBRARY UNIVERSITY manufactured megohmmeter metal electrodes Metal Finishing Guidebook MLCC Multilayer Ceramic Capacitors nickel and tin-lead ORNIA plated deposit plated MLCC plating procedure Printed Circuit Board Rinse Sacrificial anodes SAN DIEGO ERSITY SAN DIEGO LIBRARY SAN DIEGO UNIVERSITY shown in Figure Sn-Pb solder Solderon LG standard caps Standard Silver Terminals Std Dev tensile terminal adhesion test terminal strength thick film typically UNIVERSITY SAN DIEGO wrap-around