Lumped Elements for RF and Microwave CircuitsArtech House, 2003 - 488 Seiten Annotation Due to the unprecedented growth in wireless applications over the past decade, development of low-cost solutions for RF and microwave communication systems has become of great importance. This practical new book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The books offers you an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. |
Inhalt
1 | |
2 | |
4 | |
14 Basic Design of Lumped Elements | 6 |
141 Capacitor | 7 |
142 Inductor | 8 |
15 LumpedElement Modeling | 9 |
16 Fabrication | 11 |
72 Design Considerations | 239 |
722 Multilayer Capacitor | 241 |
723 QEnhancement Techniques | 244 |
724 Voltage Tunable Capacitor | 247 |
725 HighVoltage Operation | 249 |
References | 251 |
Resistors | 253 |
82 Basic Definitions | 255 |
17 Applications | 12 |
References | 13 |
Inductors | 17 |
22 Basic Definitions | 18 |
223 Mutual Inductance | 20 |
225 Impedance | 21 |
227 Quality Factor | 22 |
228 SelfResonant Frequency | 23 |
23 Inductor Configurations | 24 |
24 Inductor Models | 25 |
242 CoupledLine Approach | 28 |
243 Mutual Inductance Approach | 34 |
244 Numerical Approach | 36 |
245 MeasurementBased Model | 38 |
25 Coupling Between Inductors | 45 |
252 HighResistivity Substrates | 46 |
26 Electrical Representations | 50 |
262 Network Representations | 51 |
References | 52 |
Printed Inductors | 57 |
31 Inductors on Si Substrate | 58 |
311 Conductor Loss | 60 |
312 Substrate Loss | 63 |
313 Layout Considerations | 64 |
314 Inductor Model | 65 |
315 QEnhancement Techniques | 69 |
316 StackedCoil Inductor | 80 |
317 Temperature Dependence | 84 |
32 Inductors on GaAs Substrate | 86 |
321 Inductor Models | 87 |
322 Figure of Merit | 88 |
324 QEnhancement Techniques | 104 |
325 Compact Inductors | 112 |
326 High Current Handling Capability Inductors | 116 |
33 Printed Circuit Board Inductors | 118 |
34 Hybrid Integrated Circuit Inductors | 121 |
342 ThickFilm Inductors | 124 |
343 LTCC Inductors | 126 |
35 Ferromagnetic Inductors | 127 |
References | 129 |
Wire Inductors | 137 |
412 Compact HighFrequency Inductors | 144 |
42 Bond Wire Inductor | 146 |
421 Single and Multiple Wires | 147 |
422 Wire Near a Corner | 150 |
423 Wire on a Substrate Backed by a Ground Plane | 151 |
424 Wire Above a Substrate Backed by a Ground Plane | 153 |
425 Curved Wire Connecting Substrates | 154 |
426 Twisted Wire | 155 |
43 Wire Models | 156 |
433 MeasurementBased Model for Bond Wires | 158 |
44 Magnetic Materials | 160 |
References | 161 |
Capacitors | 163 |
52 Capacitor Parameters | 165 |
522 Effective Capacitance | 166 |
525 Quality Factor | 167 |
528 Dissipation Factor or Loss Tangent | 170 |
53 Chip Capacitor Types | 171 |
532 Multiplate Capacitor | 172 |
54 Discrete Parallel Plate Capacitor Analysis | 173 |
542 FlatMounted Series Capacitor | 176 |
543 FlatMounted Shunt Capacitor | 177 |
544 MeasurementBased Model | 178 |
55 Voltage and Current Ratings | 181 |
553 Maximum Power Dissipation | 182 |
56 Capacitor Electrical Representation | 185 |
562 Network Representations | 187 |
References | 188 |
Monolithic Capacitors | 191 |
61 MIM Capacitor Models | 192 |
611 Simple Lumped Equivalent Circuit | 193 |
612 Coupled MicrostripBased Distributed Model | 194 |
613 Single MicrostripBased Distributed Model | 198 |
614 EC Model for MIM Capacitor on Si | 202 |
615 EM Simulations | 204 |
62 HighDensity Capacitors | 206 |
621 Multilayer Capacitors | 208 |
622 UltraThinFilm Capacitors | 211 |
623 HighK Capacitors | 212 |
625 Ferroelectric Capacitors | 214 |
63 Capacitor Shapes | 216 |
631 Rectangular Capacitors | 217 |
632 Circular Capacitors | 218 |
64 Design Considerations | 220 |
642 Tunable Capacitor | 223 |
References | 227 |
Interdigital Capacitors | 229 |
71 Interdigital Capacitor Models | 230 |
712 JInverter Network Equivalent Representation | 235 |
713 FullWave Analysis | 236 |
714 MeasurementBased Model | 238 |
822 Temperature Coefficient | 256 |
825 Maximum Frequency of Operation | 257 |
831 Chip Resistors | 258 |
84 HighPower Resistors | 265 |
85 Resistor Models | 267 |
851 EC Model | 268 |
852 Distributed Model | 269 |
853 Meander Line Resistor | 270 |
86 Resistor Representations | 272 |
87 Effective Conductivity | 274 |
88 Thermistors | 276 |
Via Holes | 279 |
912 Via Hole Ground | 281 |
92 Via Hole Models | 282 |
921 Analytical Expression | 283 |
922 Quasistatic Method | 284 |
923 Parallel Plate Waveguide Model | 286 |
924 Method of Moments | 287 |
925 MeasurementBased Model | 289 |
93 Via Fence | 290 |
931 Coupling Between Via Holes | 293 |
94 Plated Heat Sink Via | 294 |
References | 296 |
Airbridges and Dielectric Crossovers | 299 |
102 Analysis Techniques | 301 |
1022 FullWave Analysis | 306 |
103 Models | 308 |
1032 MeasurementBased Model | 310 |
References | 315 |
Transformers and Baluns | 317 |
111 Basic Theory | 318 |
1112 Analysis of Transformers | 319 |
1113 Ideal Transformers | 322 |
1114 Equivalent Circuit Representation | 323 |
1115 Equivalent Circuit of a Practical Transformer | 325 |
1116 Wideband Impedance Matching Transformers | 326 |
1117 Types of Transformers | 329 |
1122 Bond Wire Transformer | 332 |
114 Ferrite Transformers | 336 |
115 Parallel Conductor Winding Transformers on Si Substrate | 339 |
116 Spiral Transformers on GaAs Substrate | 341 |
1161 Triformer Balun | 344 |
1162 PlanarTransformer Balun | 345 |
References | 349 |
LumpedElement Circuits | 353 |
1212 Hybrids and Couplers | 356 |
1213 Power DividersCombiners | 370 |
1214 Matching Networks | 372 |
1215 LumpedElement Biasing Circuit | 377 |
122 Control Circuits | 380 |
1221 Switches | 381 |
1222 Phase Shifters | 387 |
1223 Digital Attenuator | 390 |
References | 392 |
Fabrication Technologies | 395 |
1311 Materials | 396 |
1312 Mask Layouts | 401 |
132 Printed Circuit Boards | 402 |
1321 PCB Fabrication | 404 |
1322 PCB Inductors | 405 |
1331 MFC Fabrication | 407 |
1332 MPC Applications | 408 |
134 Hybrid Integrated Circuits | 410 |
1342 ThickFilm Technology | 412 |
1343 Cofired Ceramic and GlassCeramic Technology | 414 |
135 GaAs MICs | 416 |
1351 MMIC Fabrication | 418 |
1352 MMIC Example | 421 |
137 Micromachining Fabrication | 424 |
References | 425 |
Microstrip Overview | 429 |
1412 Effect of Strip Thickness | 431 |
142 Design Considerations | 432 |
1421 Effect of Dispersion | 433 |
1423 Quality Factor Q | 435 |
1424 Enclosure Effect | 438 |
1425 Frequency Range of Operation | 443 |
1426 PowerHandling Capability | 444 |
143 Coupled Microstrip Lines | 456 |
1431 EvenMode Capacitance | 457 |
1432 OddMode Capacitance | 458 |
1433 Characteristic Impedances | 459 |
144 Microstrip Discontinuities | 460 |
145 Compensated Microstrip Discontinuities | 461 |
1452 Chamfered Bend | 462 |
1453 TJunction | 463 |
References | 465 |
Appendix | 469 |
About the Author | 471 |
473 | |
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Lumped Elements for RF and Microwave Circuits, Second Edition Inder J. Bahl Eingeschränkte Leseprobe - 2022 |
Häufige Begriffe und Wortgruppen
airbridge alumina applications Artech House Bahl balun bandwidth bond wire C₁ C₂ calculated ceramic characteristic impedance chip capacitor coefficient coil components Computer-Aided Engineering conductor configuration connected couplers coupling dielectric constant EC model eddy current electrical Electron equivalent circuit fabricated film Frequency GHz fres GaAs substrate given ground plane hole hybrid IEEE IEEE MTT-S Int IEEE Trans inductance value insertion loss Integrated Circuits interdigital capacitor L₁ layer layout line width lumped elements lumped-element magnetic materials maximum measured metal Micromachined microstrip lines Microwave Circuits Microwave Symp Microwave Theory Tech MICs MMIC Monolithic multilayer networks number of turns parasitic capacitance passive components polyimide ports Q-factor Qeff quality factor R₁ R₂ reactance Reprinted with permission resistor resonant frequency RF and Microwave S-parameter self-resonant frequency sheet resistance shown in Figure shunt silicon simulated Spiral Inductors structure Table techniques temperature thin-film transformer transmission line VSWR