A Wafer-thick Trench Isolation Technology for Automotive PIC Applications

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Hong Kong University of Science and Technology, 2009 - 80 Seiten

Bibliografische Informationen

TitelA Wafer-thick Trench Isolation Technology for Automotive PIC Applications
Autor/inJingmeng Sun
VerlagHong Kong University of Science and Technology, 2009
Länge80 Seiten
  
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